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IMC Metals America

Oxygen Free (OF) Copper Rod

HIGH-RELIABILITY MATERIAL

Purity Engineered for Critical Performance

Oxygen free copper is a group of high-purity copper grades refined to contain virtually no dissolved oxygen and minimal other impurities. Our oxygen free copper rods serve as the preferred feedstock and component material for demanding electrical applications, thermal management systems, vacuum hardware, and cryogenic devices.

Typical copper content is ≥ 99.95% Cu for C10200 (OF grade) and ≥ 99.99% Cu for C10100 (OFE grade), with maximum oxygen content held below 0.001%. These grades are produced under carefully controlled conditions to prevent contamination and preserve the properties that make elemental copper so valuable as a conductor, and comply with ASTM B170 and equivalent EN/IEC designations.

WHY ENGINEERS CHOOSE OF / OFHC COPPER ROD

Reliability When It's Non-Negotiable

High Purity Metal
Copper content of ≥ 99.95–99.99% with total extraneous elements held to a minimum, giving engineers a predictable, contamination-free base material.
Superior Electrical Conductivity
OFHC-grade rod achieves 101% IACS or more at 20°C in the annealed state — more conductive than standard copper, with thermal conductivity of approximately 390–400 W/m·K.
Hydrogen Embrittlement Resistance
With oxygen below 5–10 ppm, the Cu₂O phase is effectively eliminated, allowing safe use in brazing, heat treatment, and hydrogen-rich reducing atmospheres.
Better Corrosion Resistance
The absence of Cu₂O inclusions — which can act as localized corrosion initiation sites — gives oxygen free copper better corrosion resistance than standard ETP copper.
Greater Flexibility & Impact Strength
Better ductility and impact strength versus oxygen-bearing grades support fine wire drawing, coiling, and complex bending in high-reliability industrial use.
MATERIAL GRADES & STANDARDS

Selecting the Right Grade

Selection of the correct OF or OFHC grade is driven by required purity, maximum oxygen content, conductivity specifications, and applicable industrial standards. Impurity control matters more than simply chasing the lowest oxygen number — trace elements like silver, lead, tin, iron, and sulfur each reduce conductivity and can affect downstream process reliability.

Grade (UNS)Cu MinimumMax Oxygen (ppm)Conductivity (% IACS, Annealed)Key Standards
C10100 (OFE)≈ 99.99%≤ 5 ppm (0.0005%)≥ 101%ASTM B170 Grade 1; EN CW009A
C10200 (OF)≈ 99.95%≤ 10 ppm (0.0010%)≈ 100–101%ASTM B170 Grade 2; EN CW008A
C11000 (ETP)≈ 99.90%200–400 ppm≈ 100%ASTM B187; EN CW004A

“Oxygen free” (OF) refers broadly to copper with oxygen below 10 ppm. “Oxygen free high conductivity” (OFHC) emphasizes that the material meets both low-oxygen and high electrical conductivity thresholds — typically 101% IACS or more at 20°C in the annealed state. “Oxygen free electronic” (OFE) is the highest-purity subset, with oxygen ≤ 5 ppm and total extraneous elements below 0.01%. Engineers should specify grade, maximum oxygen in ppm, and minimum conductivity in % IACS on drawings and purchase orders. Certificates of analysis or EN 10204 Type 3.1 mill test certificates with traceable heat and lot numbers are a standard requirement.

HOW IT'S MADE

A Production Route Built to Protect Purity

Oxygen free copper rod is produced through direct conversion of high-purity cathodes into rod form via continuous casting or upcasting, with strict control of atmosphere and melt chemistry throughout the refining process. The process begins with furnace charging using LME Grade A cathodes or equivalent extra high grade feedstock, protected from atmospheric oxygen using an inert gas cover or a carbonaceous flux layer over the melt surface.

  • Atmosphere Control — inert gas or flux cover during melting and casting, with no atmospheric exposure permitted during critical phases.

  • Vacuum Degassing & Filtration — removes dissolved gases and eliminates inclusions or slag from the melt.
  • Continuous Monitoring — oxygen (ppm) and trace elements are tracked throughout production to hold OFHC limits.
CASTING & FORMING

From Cathode to Finished Rod

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Controlled Melting
High-purity cathodes are melted under an inert gas cover or carbonaceous flux, with deoxidation and vacuum or inert processing controlling residual oxygen throughout.
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Upcast or Continuous Casting
Casting via vertical upcast or horizontal continuous casting technology produces rod in diameters such as 8mm, 12.5mm, and 16mm, ready for wire drawing or machining.
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Rolling, Drawing & Annealing
Downstream hot rolling, cold drawing, and annealing are optimized to preserve electrical properties and mechanical characteristics ahead of final testing.

Process parameters — withdrawal speed, mold cooling rate, and melt temperature — directly influence surface quality, grain size, and internal soundness of the castings. Selected scrap streams such as Mill Berry or ETP scrap can sometimes enter the production cycle, but only under tight process control to meet OFHC oxygen and impurity limits.

PROPERTIES

Physical, Mechanical & Conductivity Properties

Engineers typically select oxygen free copper rod for the combination of superior electrical conductivity, high thermal conductivity, excellent ductility, and stable behavior in aggressive thermal or vacuum environments.
PropertyC10100 (OFE), AnnealedC10200 (OF), Annealed
Electrical Conductivity (% IACS)≥ 101%100–101%
Resistivity (µΩ·cm)~1.70~1.72
Thermal Conductivity (W/m·K)~391–400~390–397
Tensile Strength, Annealed (MPa)200–260200–260
Yield Strength, Annealed (MPa)70–10070–100
Elongation, Annealed (%)35–55%35–55%
Density (g/cm³)8.948.94
  • If components will be brazed or heat-treated in a reducing atmosphere (hydrogen, forming gas), specify OFE or OFHC.

  • For service temperatures above 200–300°C in hydrogen-bearing atmospheres, never use ETP copper.

  • For UHV systems requiring bake-out at elevated temperature, OFE grade is preferred to avoid both embrittlement and outgassing.

  • A related alloy, oxygen free phosphorus-containing copper (CuOFP), improves creep strength for long-term high-temperature exposure — used in nuclear waste canisters under the KBS-3 concept.
HIGH-TEMPERATURE PERFORMANCE

Built to Resist Hydrogen Embrittlement

When copper containing Cu₂O is exposed to hydrogen at elevated temperature, hydrogen diffuses into the metal and reacts with oxide inclusions at grain boundaries to form water vapor. Because this vapor cannot escape, pressure builds internally, causing intergranular cracking, blistering, and catastrophic loss of ductility — the mechanism that makes standard ETP copper unsuitable for reducing or hydrogen-bearing atmospheres.

Oxygen free copper lacks the oxygen needed for hydrogen embrittlement. With oxygen content below 5–10 ppm, the material can safely be used during high-temperature brazing and soldering, heat treatment in moist or reducing atmospheres, and operation in hydrogen-rich environments such as power generation equipment and vacuum furnaces.

INDUSTRIAL APPLICATIONS

Ideal For

Electrical & Electronic

High-frequency transmission components, precision signal conductors, transformer windings, busbars, and magnet coils.

High-End Audio & Video

OFC minimizes power loss in high-frequency lines and is preferred for signal transmission cables where fidelity matters.

Automotive & Aerospace

Critical wiring harnesses requiring reliability under vibration and thermal cycling.

Vacuum & Semiconductor

UHV chambers, plasma deposition hardware, sputtering targets, and semiconductor manufacturing tooling with near-zero outgassing.

Cryogenic & Scientific

Superconducting magnet windings, cryostats, particle accelerator components, and fusion research devices.

Thermal Management

Heat spreaders, cooling plates, injection mold inserts, and laser or power electronics cooling blocks.

Concrete application examples: RF cavity conductors operating in the MHz–GHz range under UHV at 10⁻⁹ mbar; power distribution busbars carrying >10 kA with temperature rise limits below 20–30 K; vacuum furnace elements brazed at 400–600°C in forming gas; and superconducting magnets at ~4 K requiring a high RRR stabilizer matrix.

SUPPLY & DOCUMENTATION

Technical Specifications

Material Grades
C10100 (OFE) and C10200 (OF) oxygen free copper
Copper Content
≈ 99.99% (C10100) / ≈ 99.95% (C10200) minimum
Oxygen Content
≤ 5 ppm (C10100) / ≤ 10 ppm (C10200)
Electrical Conductivity
≥ 101% IACS at 20°C, annealed
Thermal Conductivity
Approximately 390–400 W/m·K
Available Diameters
8mm, 10mm, 12.5mm, 16mm, 20mm and above
Supply Forms
Round rod, coiled rod for continuous drawing, straight lengths, and machined preforms
Surface Options
Peeled, drawn, or ground surfaces to specified tolerance
Standards Compliance
ASTM B170 (Grade 1 / Grade 2), EN CW009A / EN CW008A
Documentation
EN 10204 Type 3.1 / 3.2 certificates with chemical analysis, conductivity, and full heat/lot traceability
Packaging
Clean-room compatible packaging available for cleanliness-sensitive environments
RFQ CHECKLIST

What to Include on Your Purchase Order

Specifying the correct oxygen free copper grade at the drawing stage prevents costly failures downstream. Consistent quality and full traceability are the baseline, not the exception — make sure every line item below is addressed.

  1. Confirm UNS grade (C10100 vs C10200) and required oxygen content in ppm.

  2. Specify temper (annealed, half-hard), mechanical property minima, and conductivity ≥ 101% IACS.

  3. Define dimensions, tolerances, surface finish, and form (bar, rod, coil).

  4. Require a mill test report with full chemical analysis, conductivity test, and traceable heat/lot number.

  5. Specify packaging and handling requirements for cleanliness-sensitive environments.
FAQ

Frequently Asked Questions

"Oxygen free" (OF) refers broadly to copper with oxygen below 10 ppm. "Oxygen free high conductivity" (OFHC) meets both low-oxygen and high conductivity thresholds — typically ≥101% IACS at 20°C. "Oxygen free electronic" (OFE) is the highest-purity subset, with oxygen ≤5 ppm and total extraneous elements below 0.01%.

ETP copper (C11000) carries roughly 200–400 ppm oxygen and about 100% IACS conductivity. OF and OFHC grades hold oxygen to 10 ppm or less and reach 101% IACS or more, with better corrosion resistance and no risk of hydrogen embrittlement.

Chemical analysis reporting Cu, O, and key trace elements (P, Ag, S, Fe, Ni, Pb) per heat, along with mechanical test results and conductivity measurements. EN 10204 Type 3.1 or 3.2 certificates with traceable lot and rod coil numbers are available.

Confirm the UNS grade and oxygen content required, temper and mechanical property minima, dimensions and surface finish, mill test report requirements, and any packaging or cleanliness handling needs.

Contact Us

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Whether you need a quote, have technical specifications to review, or are looking for a more dependable supply partner, our team is ready to help. IMC works with engineers, manufacturers, and procurement teams to deliver high-quality copper products and specialty metals with the reliability your operation depends on.